Packing: 20L, 200L plastic drum Net weight: 25kg/drum 250kg/drum Storage:Clean, dry, ventilated environment; containers closed; protect from heat; keep away from strong alkali substances Transportation: Non-dangerous goods, avoid violent oscillation, can not be inverted
Welcome to our product page featuring advanced Hydrofluoroether (HFE) Electronic Coolants. As electronic systems become more powerful and compact, effective heat dissipation is critical for performance, reliability, and lifespan. Our range of HFE coolants provides a safe, efficient, and reliable solution for thermal management in demanding electronic applications. These dielectric fluids are ideal for direct contact cooling and heat transfer in systems where electrical conductivity must be avoided.
HFEs are specifically designed to meet the rigorous requirements of modern electronic cooling:
Excellent Dielectric Strength: Electrically non-conductive, making them safe for direct contact with sensitive electronic components, even energized ones.
Non-Flammable: Significantly enhances safety by eliminating fire risks associated with hydrocarbon-based coolants.
Wide Operating Temperature Range: Offer very low freezing points and suitable boiling points, enabling effective cooling across broad temperature spectrums.
Efficient Heat Transfer: Possess properties that facilitate efficient heat absorption and dissipation.
Low Viscosity: Ensures good flow characteristics for easy pumping and circulation within cooling systems.
Materials Compatibility: Generally compatible with a wide range of materials commonly used in electronic assemblies and cooling systems.
Low Toxicity & Safe Handling: Exhibit favorable safety profiles compared to many alternative fluids.
We offer a variety of HFE electronic coolant grades with different boiling points, viscosities, and other properties to suit various cooling methods and temperature requirements. Below are typical properties for a selection of our grades:
Item | Unit | FCH 101 | FCH 202 | FCH-102 | FCH-109 | DH 133 | DH-164 | HFPD | HFPT |
Boiling point | °C | 54.5 | 56 | 72 | 101 | 133 | 164 | 49 | 110-115 |
Freezing point | °C | < -70 | <-70 | < -70 | No data | No data | No data | <-70 | <-70 |
Density | Kg/m³ | 1.4 | 1.49 | 1.53 | 1.58 | 1.62 | 1.65 | 1.58 | 1.83 |
Kinematic viscosity | cSt | 0.32 | 0.32 | 0.36 | No data | No data | No data | / | / |
Vaporpressure @25°C | MPa | 0.031 | 0.028 | 0.014 | No data | 0.00098 | No data | / | / |
Water content | Ppm | ≤ 50 | ≤50 | ≤50 | ≤50 | ≤ 50 | ≤50 | ≤20 | |
Iindexof refraction | / | 1.283 | 1.276 | 1.269 No data | No data | 1.279 | No data | / | / |
Application | Use direct contact to cool electronic components such as computers, transformers, and fuel cells. Used as a cooling medium for semiconductor etching equipment, ion sputtering equipment and hot stamping equipment. | Liquids leaked from electronic component tests; coolants for high-voltage transformers and high-power electronic compon ents; constant temperature coolants For etching equipment, ion implantation equipment, etc. | Electronic coolant |
Note: The values presented in this table are typical properties and should not be used for establishing specifications. "No data" or "/" indicates information was not available in the source table. Specific properties may vary slightly between batches. Please consult the official technical data sheet for precise specification limits and test conditions.
Our HFE Electronic Coolants are trusted in a variety of demanding thermal management applications:
Data Centers: Ideal for single-phase or two-phase immersion cooling of servers and high-performance computing (HPC) equipment.
Power Electronics: Cooling of high-voltage transformers, power supplies, and other high-power electronic components (e.g., DH 133, DH-164 mentioned for high-voltage/high-power).
Semiconductor Manufacturing: Used as a cooling medium for etching equipment, ion implantation, and hot stamping equipment. (e.g., FCH 101, FCH 202, FCH-102 mentioned for this)
Electric Vehicles (EVs): Cooling of battery packs, power converters, and charging systems.
Aerospace and Defense: Thermal management in critical avionic and defense systems.
Medical Devices: Cooling of medical imaging equipment and laser systems.
Testing and Temperature Cycling: Used in constant temperature baths and thermal shock testing equipment (e.g., DH 133, DH-164 mentioned for constant temperature).
Fuel Cells: Direct contact cooling in fuel cell stacks (e.g., FCH 101, FCH 202, FCH-102 mentioned for fuel cells).
The diverse properties of our HFE grades make them suitable for several electronic cooling approaches:
Single-Phase Immersion Cooling: Components are fully submerged in the fluid.
Two-Phase Immersion Cooling: Fluid boils off the component surface, providing highly efficient heat transfer (requires a coolant with a suitable boiling point).
Direct Contact Cooling: Fluid is applied directly to specific hot spots on components.
Heat Transfer Loops: Circulated through cold plates or heat exchangers.
Our HFE coolants offer a more favorable environmental profile compared to older perfluorocarbon (PFC) coolants, featuring:
Typically Low Global Warming Potential (GWP).
Zero Ozone Depletion Potential (ODP).
Selecting the optimal coolant is vital for the performance, reliability, and safety of your electronic systems. Our range of HFE electronic coolants provides high dielectric strength, non-flammability, a wide operating temperature range, and excellent thermal performance. We offer reliable products backed by technical expertise to help you solve your thermal management challenges.
Ready to explore the benefits of high-performance HFE electronic coolants for your application? Contact us today to discuss your specific cooling requirements, system design, and thermal load. We can help you select the optimal HFE grade and provide detailed technical data sheets, safety information, and application guidance.
Contact: Tony Li
Phone: +86-13263299644
Tel: +86-13263299644
Email: sales@ecoviaet.com
Add: No 3 Youyi Road,Tangshan,Huantai,Zibo,China
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